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| MC74AC86, MC74ACT86 Quad 2-Input Exclusive-OR Gate Features * Outputs Source/Sink 24 mA * Pb-Free Packages are Available http://onsemi.com 14 PDIP-14 N SUFFIX CASE 646 1 MAXIMUM RATINGS Rating DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Sink/Source Current, per Pin DC VCC or GND Current per Output Pin Storage Temperature Symbol VCC Vin Vout Iin Iout ICC Tstg Value -0.5 to +7.0 -0.5 to VCC +0.5 -0.5 to VCC +0.5 20 50 50 -65 to +150 Unit V V V mA mA mA C 14 1 SOIC-14 D SUFFIX CASE 751A 14 1 TSSOP-14 DT SUFFIX CASE 948G 14 1 SOEIAJ-14 M SUFFIX CASE 965 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Pinout: 14-Lead Packages Conductors (Top View) VCC 14 13 12 11 10 9 8 1 2 3 4 5 6 7 GND ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 5 of this data sheet. (c) Semiconductor Components Industries, LLC, 2006 October, 2006 - Rev. 8 1 Publication Order Number: MC74AC86/D MC74AC86, MC74ACT86 RECOMMENDED OPERATING CONDITIONS Symbol VCC Vin, Vout tr, tf Supply Voltage DC Input Voltage, Output Voltage (Ref. to GND) Input Rise and Fall Time (Note 1) AC Devices except Schmitt Inputs Input Rise and Fall Time (Note 2) ACT Devices except Schmitt Inputs Junction Temperature (PDIP) Operating Ambient Temperature Range Output Current - High Output Current - Low VCC @ 3.0 V VCC @ 4.5 V VCC @ 5.5 V VCC @ 4.5 V VCC @ 5.5 V Parameter AC ACT Min 2.0 4.5 0 - - - - - - -40 - - 150 40 25 10 8.0 - 25 - - Typ 5.0 5.0 Max 6.0 5.5 VCC - - - - - 140 85 -24 24 ns/V C C mA mA ns/V Unit V V tr, tf TJ TA IOH IOL 1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. DC CHARACTERISTICS 74AC 74AC TA = -40C to +85C Unit V Conditions VOUT = 0.1 V or VCC - 0.1 V VOUT = 0.1 V or VCC - 0.1 V IOUT = -50 mA Symbol VIH Parameter Minimum High Level Input Voltage Maximum Low Level Input Voltage Minimum High Level Output Voltage VCC (V) 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 TA = +25C Typ 1.5 2.25 2.75 1.5 2.25 2.75 2.99 4.49 5.49 - - - 0.002 0.001 0.001 - - - - - - - 2.1 3.15 3.85 0.9 1.35 1.65 2.9 4.4 5.4 2.56 3.86 4.86 0.1 0.1 0.1 0.36 0.36 0.36 0.1 - - 4.0 Guaranteed Limits 2.1 3.15 3.85 0.9 1.35 1.65 2.9 4.4 5.4 2.46 3.76 4.76 0.1 0.1 0.1 0.44 0.44 0.44 1.0 75 -75 40 VIL V VOH V V *VIN = VIL or VIH -12 mA IOH -24 mA -24 mA IOUT = 50 mA VOL Maximum Low Level Output Voltage 3.0 4.5 5.5 3.0 4.5 5.5 V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA VI = VCC, GND VOLD = 1.65 V Max VOHD = 3.85 V Min VIN = VCC or GND IIN IOLD IOHD ICC Maximum Input Leakage Current Minimum Dynamic Output Current Maximum Quiescent Supply Current 5.5 5.5 5.5 5.5 mA mA mA mA *All outputs loaded; thresholds on input associated with output under test. Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. http://onsemi.com 2 MC74AC86, MC74ACT86 AC CHARACTERISTICS (For Figures and Waveforms - See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) 74AC TA = +25C CL = 50 pF Min 2.0 1.5 2.0 1.5 Typ 6.0 4.5 6.5 4.5 Max 11.5 8.5 11.5 8.5 74AC TA = -40C to +85C CL = 50 pF Min 1.5 1.0 1.5 1.0 Max 12.5 9.0 12.5 9.5 Unit ns ns Symbol tPLH tPHL Propagation Delay Inputs to Outputs Propagation Delay Inputs to Outputs Parameter VCC* (V) 3.3 5.0 3.3 5.0 Fig. No. 3-5 3-5 *Voltage Range 3.3 V is 3.3 V 0.3 V Voltage Range 5.0 V is 5.0 V 0.5 V. DC CHARACTERISTICS 74ACT 74ACT TA = -40C to +85C Unit V V V Conditions VOUT = 0.1 V or VCC - 0.1 V VOUT = 0.1 V or VCC - 0.1 V IOUT = -50 mA *VIN = VIL or VIH -24 mA IOH -24 mA IOUT = 50 mA *VIN = VIL or VIH 24 mA IOL 24 mA VI = VCC, GND VI = VCC - 2.1 V VOLD = 1.65 V Max VOHD = 3.85 V Min VIN = VCC or GND 2.0 2.0 0.8 0.8 4.4 5.4 3.76 4.76 0.1 0.1 0.44 0.44 1.0 1.5 75 -75 40 Symbol VIH VIL VOH Parameter Minimum High Level Input Voltage Maximum Low Level Input Voltage Minimum High Level Output Voltage VCC (V) 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 TA = +25C Typ 1.5 1.5 1.5 1.5 4.49 5.49 - - 0.001 0.001 - - 2.0 2.0 0.8 0.8 4.4 5.4 3.86 4.86 0.1 0.1 0.36 0.36 0.1 0.6 - - - - - - 4.0 Guaranteed Limits V VOL Maximum Low Level Output Voltage 4.5 5.5 4.5 5.5 V V IIN DICCT IOLD IOHD ICC Maximum Input Leakage Current Additional Max. ICC/Input Minimum Dynamic Output Current Maximum Quiescent Supply Current 5.5 5.5 5.5 5.5 5.5 mA mA mA mA mA *All outputs loaded; thresholds on input associated with output under test. Maximum test duration 2.0 ms, one output loaded at a time. AC CHARACTERISTICS (For Figures and Waveforms - See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) 74ACT TA = +25C CL = 50 pF Min 1.5 1.5 Typ 8.5 7.0 Max 9.5 9.5 74ACT TA = -40C to +85C CL = 50 pF Min 1.0 1.0 Max 10.0 10.5 Unit ns ns Symbol tPLH tPHL Propagation Delay Propagation Delay Parameter VCC* (V) 5.0 5.0 Fig. No. 3-5 3-5 *Voltage Range 5.0 V is 5.0 V 0.5 V. http://onsemi.com 3 MC74AC86, MC74ACT86 CAPACITANCE Symbol CIN CPD Input Capacitance Power Dissipation Capacitance Parameter Value Typ 4.5 35 Unit pF pF Test Conditions VCC = 5.0 V VCC = 5.0 V ORDERING INFORMATION Device MC74AC86N MC74AC86NG MC74ACT86N MC74ACT86NG MC74AC86D MC74AC86DG MC74AC86DR2 MC74AC86DR2G MC74ACT86D MC74ACT86DG MC74ACT86DR2 MC74ACT86DR2G MC74AC86DTR2 MC74ACT86DTR2 MC74ACT86MEL MC74ACT86MELG Package PDIP-14 PDIP-14 (Pb-Free) PDIP-14 PDIP-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) TSSOP-14* TSSOP-14* SOEIAJ-14 SOEIAJ-14 (Pb-Free) 2000 / Tape & Reel 2500 / Tape & Reel 55 Units / Rail 2500 / Tape & Reel 55 Units / Rail Shipping 25 Units / Rail For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free. http://onsemi.com 4 MC74AC86, MC74ACT86 MARKING DIAGRAMS PDIP-14 MC74AC86N AWLYYWWG SOIC-14 AC86G AWLYWW TSSOP-14 AC 86 ALYWG G SOEIAJ-14 74ACT86 ALYWG ACT86G AWLYWW A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb-Free Package (Note: Microdot may be in either location) http://onsemi.com 5 MC74AC86, MC74ACT86 PACKAGE DIMENSIONS PDIP-14 CASE 646-06 ISSUE P 14 8 B 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 --- 10 _ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 --- 10 _ 0.38 1.01 A F N -T- SEATING PLANE L C H G D 14 PL K M J M DIM A B C D F G H J K L M N 0.13 (0.005) http://onsemi.com 6 MC74AC86, MC74ACT86 PACKAGE DIMENSIONS SOIC-14 CASE 751A-03 ISSUE H -A- 14 8 -B- P 7 PL 0.25 (0.010) M B M 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. G C -T- SEATING PLANE R X 45 _ F D 14 PL 0.25 (0.010) M K TB S M A S J DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 SOLDERING FOOTPRINT* 7X 7.04 1 0.58 14X 14X 1.52 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MC74AC86, MC74ACT86 PACKAGE DIMENSIONS TSSOP-14 CASE 948G-01 ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U S M TU S V N S 2X L/2 14 8 0.25 (0.010) M L PIN 1 IDENT. 1 7 B -U- N F DETAIL E K 0.15 (0.006) T U S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. DIM A B C D F G H J J1 K K1 L M MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 --- 1.20 --- 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0_ 8_ 0_ 8_ J J1 SECTION N-N -W- C 0.10 (0.004) -T- SEATING PLANE D G H DETAIL E SOLDERING FOOTPRINT* 7.06 1 0.36 14X 14X 1.26 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 EEE CCC EEE CCC CCC A -V- K1 0.65 PITCH DIMENSIONS: MILLIMETERS MC74AC86, MC74ACT86 PACKAGE DIMENSIONS SOEIAJ-14 CASE 965-01 ISSUE A 14 8 LE Q1 E HE M_ L DETAIL P 1 7 Z D e A VIEW P NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 1.42 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.004 0.008 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.056 c b 0.13 (0.005) M A1 0.10 (0.004) ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 9 MC74AC86/D |
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